Thin film coating design

Sputter deposition is a physical vapor deposition (PVD) method of depositing thin films and coatings of material onto a substrate. It involves removing atoms from the surface of a solid target material by bombarding the target with energetic particles. The ejected target atoms then travel to the substrate where they condense to form the deposited film.

With sputtering deposition, it is possible to grow single layer and multilayer thin films with thickness of each deposited layer varying in the range of angstroms to thousands of nanometers. The coating facility at DTU Space is a DC magnetron sputtering chamber optimized to make multilayer coatings. The film can be grown on flat or curved surfaces.